micro chip scanning

Fumax Tech tana bayar da kayan kwalliya masu inganci (PCB) wadanda suka hada da PCB mai yawan-lakabi (kwamiti mai zagayawa), HDI mai girma (mai hada-hadar mai girma), PCB ba da tsari ba da kuma PCB mai sassauci-da dai sauransu.

A matsayinta na tushe, Fumax ya fahimci mahimmancin abin dogara na PCB. Muna saka hannun jari a cikin mafi kyawun kayan aiki da ƙwararrun towararru don samar da alloli mafi inganci.

Hankula nau'ikan PCB suna ƙasa.

M PCB

M & M lankwasa PCBs

HDI PCB

Babban Frequency PCB

Babban TG PCB

LED PCB

Karfe PCB

Namiji Cooper PCB

Allon PCB

 

Ana nuna ƙarfin masana'antunmu a cikin ginshiƙi da ke ƙasa.

Rubuta

Iyawa

Matsayi

Multilayers (4-28) 、 HDI (4-20) lankwasawa 、 Karkataccen lankwasawa

Biyu Side

CEM-3 、 FR-4 、 Rogers RO4233 、 Bergquist rarfin rarya 4mil – 126mil (0.1mm-3.2mm)

Masu yawa

4-28 yadudduka, kaurin jirgin 8mil-126mil (0.2mm-3.2mm)

Binnewa / Makaho Ta Hanyar

4-20 yadudduka, kaurin allo 10mil-126mil (0.25mm-3.2mm)

HDI

1 + N + 1、2 + N + 2、3 + N + 3 、 Kowane Layer

Lankwasa & M-lankwasa PCB

1-8layers lankwasa PCB, 2-12layers M-lankwasa PCB HDI + M-lankwasa PCB

Laminate

 

Nau'in Soldermask (LPI)

Taiyo 、 Goo's 、 Probimer FPC .....

Mai biya Soldermask

 

Tawada carbon

 

HASL / Jagorar HASL kyauta

Kauri: 0.5-40um

OSP

 

ENIG (Ni-Au)

 

Ni-Au mai haɗa wutar lantarki

 

Electro-nickel palladium Ni-Au

Au: 0.015-0.075um Pd 0.02-0.075um Ni: 2-6umm

Lantarki. Hard Gold

 

Tin mai tsayi

 

Iyawa

Mass Production

Min Mechanical Rawar soja Hole

0.20mm

Min. Laser Rawar soja Hole

4mil (0.100mm)

Layin Layi / Tazarar Layi

2mil / 2mil

Max. Girman Panel

21.5 "X 24.5" (546mm X 622mm)

Layin Faɗi / Bada haƙuri

Rashin murfin lantarki: +/- 5um coating Kayan lantarki: +/- 10um

Haƙurin PTH Hole

+/- 0.002inch (0.050mm)

NPTH Mai Haƙuri

+/- 0.002inch (0.050mm)

Haƙuri Wuri Rami

+/- 0.002inch (0.050mm)

Hole to Edge haƙuri

+/- 0.004inch (0.100mm)

Edge zuwa Edge Haƙuri

+/- 0.004inch (0.100mm)

Layer zuwa Haƙuri Mai Laasa

+/- 0.003inch (0.075mm)

Rashin Haƙuri

+/- 10%

Shafin%

Max≤0.5%

Fasaha (Kayan HDI)

ITEM

Production

Laser Via Rawar soja / kushin

0.125 / 0.30 、 0.125 / 0.38

Makaho Ta Hanyar Rawa / Kushin

0.25 / 0.50

Layin Layi / Tazarar Layi

0.10 / 0.10

Samuwar Rami

CO2 Laser Direct Rawar soja

Gina abu

FR4 LDP (LDD); RCC 50 ~ 100 micron

Cu Kauri akan Bangon Rami

Makaho Rami: 10um (min)

Ra'ayin rabo

0.8: 1

Fasaha (M PCB)

Aiki 

Iyawa

Mirgine don mirgine (gefe ɗaya)

EE

Mirgine don mirgine (biyu)

A'A

Volume don mirgine kayan nisa mm 

250

Mafi qarancin girman girka mm 

250x250 

Matsakaicin girman girman mm 

500x500 

Alamar Majalisar SMT (Ee / A'a)

EE

Ikon Jirgin Sama (Ee / A'a)

EE

Samar da farantin ɗauri mai taushi da taushi (Ee / A'a)

EE

Max yadudduka (Hard)

10

Matsakaicin tallest (Soft plate)

6

Kimiyyar Kimiyya 

 

PI

EE

PET

EE

Tagulla na lantarki

EE

Birgima Anneal Copper tsare

EE

PI

 

Rufe fim juriya haƙuri mm

0.1 

Mafi qarancin abin rufe fim mm

0.175

Inarfafawa 

 

PI

EE

FR-4

EE

SUS

EE

EMI GASKIYA

 

Ink na Azurfa

EE

Fim din Azurfa

EE